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Sputtering Target

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Rich Experience

KOBO is a professional Metal processing company with more than 20 years of experience. Dedicated to strict quality control and attentive customer service, our experienced staff is always available to discuss your requirements and ensure complete customer satisfaction.

 

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KOBO is well equipped with Hi-tech equipments. We are fully equipped to supply a full range of refractory and reactive metals (titanium, niobium, tantalum, vanadium, molybdenum, tungsten, hafnium, zirconium,nickel etc) and their alloys, with unparalleled product support and customer service.

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Definition of Sputtering Target

 

 

Sputtering targets are materials used to produce thin films in a technique known as sputter deposition, or thin film deposition. In this process, the sputtering targets start off as a solid and is then split up by gaseous ions into small particles that form a spray and coat a material, which is called the substrate.

 

Benefits of Sputtering Target
 

Sputtering is a fundamental process in materials science and manufacturing that involves the deposition of thin films onto surfaces. Sputtering target works by bombarding a target material with high-energy ions, typically using an inert gas like argon in a vacuum chamber. When the ions collide with the target, they dislodge atoms or molecules from the surface, which then condense on a substrate to form a thin film. Sputtering target offers several advantages, including precise control over film thickness, high material purity, and the ability to deposit a wide range of materials. Sputtering target is widely used in industries such as microelectronics, optics, and coating technology to create thin films with specific properties for various applications.

High purity deposition

It allows for the deposition of high-purity thin films since it does not involve chemical reactions. This makes it suitable for applications where material purity is critical, such as in microelectronics.

Controlled film thickness

It provides precise control over the thickness of the deposited film, enabling the production of thin films with specific thickness requirements.

Uniform coating

Sputtering typically results in uniform film deposition across the entire substrate surface, ensuring consistency in film properties.

Wide material compatibility

Sputtering can be used with a wide range of materials, including metals, semiconductors, ceramics, and even some polymers, making it versatile for various applications.

Excellent adhesion

Sputtered films often exhibit strong adhesion to the substrate, reducing the risk of delamination or peeling.

High-density films

The high packing densities of high-density films can lead to improved mechanical and electrical properties.

 

Types of Sputtering Targets
 
 

Sputtering targets are made of different materials to create thin films. There are four main types of sputtering targets:

 

Metal targets

These are widely used because they conduct heat and electricity well. They're made from gold, silver, copper, aluminum, and titanium.

 
 

Ceramic targets

These are hard, wear-resistant, and chemically stable. Typical ceramics used include silicon dioxide, aluminum oxide, and titanium dioxide.

 
 

Alloy targets

These are made by combining two or more metals to create specific properties. For example, an alloy of nickel and chromium could be used to make Nickel Chromium Targets.

 
 

Composite targets

These are made by combining two or more materials of different types to create specific properties. For example, a copper and aluminum oxide composite target.

 

 

What Are Sputtering Targets Made Of?

Sputtering targets are made of various materials depending on their purpose. These can be metals, ceramics, alloys, or composites. 

Metal targets are commonly used because they conduct heat and electricity well and can create many different alloys. Examples of metals used for sputtering include gold, silver, copper, aluminum, and titanium.

 

Ceramic targets are known for their strength, resistance to wear, and resistance to chemicals. Examples of ceramics used for sputtering include aluminum oxide, silicon dioxide, and titanium dioxide.

 

Alloy targets are made by mixing two or more metals to create specific physical or chemical properties. For instance, a mixture of gold and silver can create a thin film that is conductive, but not as much as pure gold or pure silver.

 

Composite targets are produced by mixing different materials, such as metal and ceramic, to create a specific combination of properties. For example, a composite target made of copper and aluminum oxide can produce a thin film that is highly conductive and adheres well to a surface.

 

 

Molybdenum Sputtering Target (Mo)

 

What Size Is a Sputtering Target?

The first basic requirement for the deposition of metallic glass thin films by sputtering is the sputtering target. The sputtering target is usually a circular disc (or it can be rectangular depending on the equipment) of diameter between one and several inches.

As we have noticed metallic glass alloys are made up of three or more different kinds of elements in a specific composition range, therefore the sputtering target material must have a similar composition, and is not usually available commercially. Therefore sputtering targets for deposition of metallic glass thin films need to be custom made.

The multielemental alloy sputtering targets can be easily made by arc-melting or radio-frequency melting of a mixture of metals in a vacuum or inert-gas atmosphere. Another way to fabricate the sputtering target is to mix the powders of different metals and sinter the mixture at an elevated temperature under high pressure in a die of required dimensions. This technique of making the target or solid discs from powders is known as spark plasma sintering (SPS).

 

Quality Control and Testing Methods for Sputtering Targets

Making sputtering targets of good quality is very important in manufacturing. When making these targets, need to check that the material is pure and doesn't have any dirt or other stuff in it. We also need to make sure that the target has the right size and shape, and that it has a smooth surface. Lastly, need to make sure that it is not broken or dirty when it gets to the factory.

Testing the material

Test the material to make sure it is pure and doesn't have any dirt or other stuff in it. Testing instruments like x-ray machines, inductively coupled plasma (icp) analysis, and glow discharge mass spectrometry (gdms).

Checking the dimensions

Check the size and shape of the target to make sure it meets the requirements. We use machines like optical profilometry, coordinate measuring machines (cmm), and laser scanning.

Verifying the surface finish

Check the surface of the target to make sure it has the required surface finish and roughness. We use machines like scanning electron microscopy (sem), atomic force microscopy (afm), and optical microscopy.

Checking for damage and dirt

Check for any damage or dirt on the target to make sure it is not broken or dirty during transportation and storage. Techniques used for this include visual inspection, leak testing, and vacuum packaging.

 

How Do Sputtering Targets Work?

Sputtering is classified under the physical vapor deposition technique. In this process, high-energy particles are made to bombard the target or source material to eject the atoms from the target material. The ejected atoms are made to fall onto a substrate getting deposited as a thin film layer.

The sputtering system consists of a high-vacuum chamber, a gas inlet, a pump connection, a sputter target, and the required gases. The target from which the atoms are to be ejected is negatively charged and the substrate on which the thin film has to be deposited is positively charged. Plasma is generated by applying direct current (DC), alternating current (AC), or radiofrequency (RF) and by exciting the gases such as argon in a vacuum chamber. The ions in the plasma are accelerated to a sufficiently high kinetic energy and made to bombard the target. The kinetic energy imparted to the bombarding particles by plasma energy is much higher than conventional thermal energies. This results in the removal of material from the sputtering target. The substrate is maintained at a negative charge and the source atoms are accelerated toward the substrate, resulting in thin-film deposition. For electrically conductive materials, dc discharge is preferred while an rf plasma is suitable for all materials, including dielectric target materials.

To increase the sputter yield, often a so-called magnetron sputtering process is used that uses magnetic fields to confine the plasma to the sputter yield.

 

 
How to Choose Sputtering Target?

Materia

Pick the material with the properties you need for the thin film you want to create, and that can be used with your deposition method.

Purity

Keep the material as pure as possible, since impurities can mess up the properties of the thin film you're making.

Size and shape

Choose the size and shape of the target based on what you're coating and the deposition system you're using.

Deposition method

Choose the method that will give you the properties you want for your thin film, and that works with the material and what you're coating.

 

What Is the Voltage of a Sputtering Target?

Sputtering Target

Sputtering Voltage

Indium Tin Oxide (ITO)

≈200V

Copper (Cu) Aluminum (Al) Titanium (Ti)

400~600V

Manganese (Mn) Chromium (Cr)

>700V

 

Driving Forces of the Sputtering Target and Evaporation Material Market
 

Technological advancements
Continuous innovations in technology enhance the efficiency and effectiveness of sputtering target and evaporation material products and services, including advancements in materials, manufacturing processes, and digital technologies.

 

Growing demand
Increasing demand for sputtering target and evaporation material products and services, fueled by factors such as population growth, urbanization, and changing consumer preferences, is a significant driver for market expansion.

 

Regulatory support
Favorable government policies, regulations, and incentives promoting the use of sputtering target and evaporation material, such as subsidies for renewable energy projects and carbon pricing mechanisms, stimulate market growth.

 

Environmental awareness
Rising awareness about environmental sustainability and the need to reduce carbon emissions drives the adoption of eco-friendly and renewable sputtering target and evaporation material solutions.

 

Cost reduction
Ongoing cost reductions in sputtering target and evaporation material production and installation, driven by economies of scale, technological advancements, and increased competition, make these solutions more affordable and accessible.

 

Why Sputtering Targets Are an Excellent Source of Precious Metal Scrap? 

Sputter deposition is often involved in the production of semiconductors and computer chips. As such, most sputtering target materials are metallic alloys or elements, although some ceramic targets are available that create hardened thin coatings for some tools.

Once a sputtering target has been used, most will assume it is now useless. However, there is usually some valuable metal material left that should be recycled. In many cases, the metal could even turn out to be an incredibly rare precious metal like rhodium that can often be recycled as well.

Here's a list of all the sputtering targets that are worth recycling:

Aluminum targets
Aluminum sputtering is often used for semiconductor applications. Though it is not the most valuable metal, it is still in demand due to its versatility. You can find recycled aluminum in almost any modern vehicle or airplane, and it is used in many household items. Aluminum is also great for heat resistance, which makes it the perfect metal for containers.

 

Copper targets
Copper is often used for electrodes and other applications where electrical conductivity is crucial. It's not rare, but it is used in many applications like plumbing, wiring and windshield films.

 

Tin targets
Tin can be applied to many materials to improve their properties. It is used in sputtering to improve corrosion resistance.

 

Zinc targets
Zinc targets are also used for their corrosion resistance. When it is sputtered onto another metal, it can be a corrosion barrier, which is why it's typically used to produce cathodes. Zinc can also be found in batteries, propellants and paints.

 

Platinum, silver, and gold
Precious metals like gold, silver and platinum are sometimes used in sputtering applications. They provide a combination of chemical inertness and electrical conductivity, which makes them excellent for instrument and electrode production. They are also worth recycling for their financial value alone.

 

 

Our Factory

KOBO is well equipped with Hi-tech equipments, among them one is VAR(Vacuum Arc Remelt) melting furnace, a standard in industry, can allow multiple melting, it is economical to produce titanium which is for Industrial, Medical, Racing and Aerospace applications.

Another is EB( Electron Beam) melting furnace,Electron beam melting is distinguished by its superior refining capacity. Thus it is ideal for remelting and refining of metals and alloys under high vacuum in water cooled, ceramic free copper molds. It also plays an important role in manufacturing of high-pure sputtering target materials and alloys for the electronic industry.

We are fully equipped to supply a full range of refractory and reactive metals (titanium, niobium, tantalum, vanadium, molybdenum, tungsten, hafnium, zirconium,nickel etc) and their alloys. Our goal is to be a global metal resource solver.

 

Advanced Equipment
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Our Certificate
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Ultimate FAQ Guide to Sputtering Target

Q: How long does a sputtering target last?

A: The life of a sputter target is typically quantified in terms of units of power and time, like kilowatt/hours. For a target being sputtered at 500 watts for a total duty cycle of 100 hours that's 50 kilowatt/hours.

Q: How are sputtering targets made?

A: Metal sputtering targets are typically made from cast ingot. The metal or alloy is melted and solidified to ensure full density with a minimum amount of voids. The casting process can be performed in a vacuum or inert atmosphere to reduce the presence of oxides.

Q: How do sputtering targets work?

A: Sputtering is classified under the physical vapor deposition technique. In this process, high-energy particles are made to bombard the target or source material to eject the atoms from the target material. The ejected atoms are made to fall onto a substrate getting deposited as a thin film layer.

Q: What size is a sputtering target?

A: The first basic requirement for the deposition of metallic glass thin films by sputtering is the sputtering target. The sputtering target is usually a circular disc (or it can be rectangular depending on the equipment) of diameter between one and several inches. As we have noticed metallic glass alloys are made up of three or more different kinds of elements in a specific composition range, therefore the sputtering target material must have a similar composition, and is not usually available commercially.

Q: Why sputtering targets are an excellent source of precious metal scrap?

A: Sputtering targets are materials used to produce thin films in a technique known as sputter deposition, or thin film deposition. In this process, the sputtering targets start off as a solid and is then split up by gaseous ions into small particles that form a spray and coat a material, which is called the substrate. In many cases, the metal could even turn out to be an incredibly rare precious metal like rhodium that can often be recycled as well.

Q: How are sputtering targets used?

A: Sputtering targets are used to produce low-radiation coated glass – also known as Low-E glass – which is commonly used in building construction because of its ability to save energy, control light, and for aesthetics.

Q: What elements are sputtering target made of?

A: Therefore sputtering targets for deposition of metallic glass thin films need to be custom made. The multielemental alloy sputtering targets can be easily made by arc-melting or radio-frequency melting of a mixture of metals in a vacuum or inert-gas atmosphere. Another way to fabricate the sputtering target is to mix the powders of different metals and sinter the mixture at an elevated temperature under high pressure in a die of required dimensions.

Q: Sputtering target:What is the pressure in a sputtering vacuum?

A: Pressures during sputter deposition are in the mtorr range, 10-3 to some 10-2 mbar. The gas flow is usually adjusted by a flow controller, while the thickness of the layer is governed by a film thickness controller.

Q: What are sputtering targets used for?

A: Silicon sputtering targets are used to deposit thin films on silicon-based materials. They are commonly used in displays, semiconductors, optics, optical communication, and glass coating applications. They are also suitable for etching high-tech components.

Q: Sputtering target: What is sputtering and how does it work?

A: Sputtering is a way to transfer material from a sputtering target to a substrate surface. This happens in a vacuum chamber when a low-pressure gas (usually argon) is introduced. The gas is turned into a plasma by an electrical discharge, creating positively charged ions and free electrons. These ions move towards the sputtering target and hit its atoms, knocking them loose. These atoms then travel through the vacuum chamber and stick to the substrate surface, creating a thin film. There are different ways to sputter, like dc sputtering and rf sputtering, reactive sputtering, and magnetron sputtering. Each way has its pros and cons, depending on the application and desired properties of the thin film.

Q: What are sputtering targets?

A: Sputtering targets are materials used to produce thin films in a technique known as sputter deposition, or thin film deposition. In this process, the sputtering targets start off as a solid and is then split up by gaseous ions into small particles that form a spray and coat a material, which is called the substrate.

Q: What is the grain size of Sputtering Target?

A: Application data collected has shown that a high quality well designed rotary pumped magnetron sputter coater, such as the Quorum K550X, is capable of producing a continuous Pt (platinum) film with a grain size in the order of 2 nm.

Q: What is target poisoning in sputtering?

A: The performance of reactive sputtering is, however, impeded by the effect of target "poisoning", which means that a compound film is not only formed on the substrate as desired, but also on the sputter target, which results in a significantly reduced sputter yield and, thereby, reduced deposition rate.

Q: Why should you recycle sputtering targets?

A: Sputter deposition is often involved in the production of semiconductors and computer chips. As such, most sputtering target materials are metallic alloys or elements, although some ceramic targets are available that create hardened thin coatings for some tools.
Once a sputtering target has been used, most will assume it is now useless. However, there is usually some valuable metal material left that should be recycled.

Q: How to maintain long-term use of sputtering target？

A: • Store targets in a clean, dry place, away from things that might make them dirty.
• Handle targets carefully, using clean gloves and tools so you don't add dirt to them.
• Check targets often for wear and tear, like cracks or pits, which can make them work worse.
• Clean targets often to get rid of any dirt or other stuff that has built up on them.

Q: How do you make a sputtering target?

A: There are two main ways to make a sputtering target. One is casting. The alloy raw material of a certain distribution ratio is melted, and the alloy solution is poured into a mold to form an ingot, and finally, a target material is machined, and the casting method is smelted and cast in a vacuum.

Q: Sputtering Target: How thick is sputtering gold?

A: Conventional gold sputtering thickness for SEM is about 5-10 nm. The typical technical limitation for sputters is about 2-3 nm - the min size of the gold particles. For biological objects gold sputtering is not the main problem.

Q: How long does a sputtering target last?

A: The life of a sputter target is typically quantified in terms of units of power and time, like kilowatt/hours. For a target being sputtered at 500 watts for a total duty cycle of 100 hours that's 50 kilowatt/hours.

Q: What is a gold sputtering target?

A: The gold sputtering target is mainly used for layering other materials. It is a standard scanning electron microscopy coating that serves as a covering for specimens with a thin layer of conducting material.

Q: What are the limitations of sputtering target?

A: The main disadvantage of ion beam sputtering deposition is that the target area of the bombardment is too small, and the deposition rate is generally low.

As one of the leading sputtering target suppliers in China, we warmly welcome you to buy high-grade sputtering target in stock here from our factory. All our products are with high quality and low price. Contact us for quotation.

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